high techinical die ball mill

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Double Ended End Mills Double Ended mills feature end mill geometry on both ends of the tool, allowing an operator to rotate the tool once before discarding due to wear. Double ended mills are typically available in square, corner radius, and ball nose configurations. View Double Ended End Mill Offering

Double Ended End Mills Double Ended mills feature end mill geometry on both ends of the tool, allowing an operator to rotate the tool once before discarding due to wear. Double ended mills are typically available in square, corner radius, and ball nose configurations. View Double Ended End Mill Offering

chipping damage of die for trimming advanced high-strength steel sheet: evaluation and analysis - sciencedirect

Develop a measurement technique for chipped missing metal volume at trim die cutting edge.Propose an evaluation method for severity of trim die edge chipping damage.Explore effects of die materials and die uphill angles on tool life.Suggest selection of die machining orientation relative to rolling orientation.

The tool life becomes one of the critical manufacturing issues in the metal forming process of advanced high-strength steel as the material strength continually increasing. In this paper, an evaluation method on trim die chipping damage was developed. This method is based on the measurement of chipped volume, which is achieved from the area measurement on two chipped die surfaces on front and top views, to construct a missing metal triangle, which is further integrated along the die cutting edge line to obtain the loss metal volume. 18 dies made of three different materials (Caldie, AISI D2, and Vanadis 4) and six trim uphill angles were received and measured with the known total trimming cycles (hits). The measurement was achieved with two methods using two combinations of camera view directions. The die materials and trim uphill angle effect on the die performance (chipping resistance) were obtained based on average chipping rate, defined as the loss metal volume per hit. For AISI D2 dies, wide scattering of the chipping rates was seen. And it was identified that the unfavorable carbide/grain orientation relative to the trim die cutting edge line is responsible to the obtained unusual low cycle to failure. Furthermore, a simple in-line real-time die damage monitoring and measurement system is proposed, and the favorable die machining orientation relative to the rolling coordinate is suggested.

ion milling system im4000plus : hitachi high-tech in america

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The IM4000Plus Ion Milling System utilizes a broad, low-energy Ar+ ion beam milling method to produce wider, undistorted cross-section milling or flat milling, without applying mechanical stress to the sample.

Previously two separate systems were needed to perform both cross section cutting (E-3500) and wide-area sample surface fine polishing (IM3000), but with Hitachi's IM4000Plus, both applications can be run within the same machine.

Furthermore, with an increase in the maximum milling rate to 500 m/h for Si, the new Ar ion gun design of the IM4000Plus enables a reduction of cross section processing times by as much as 66% compared to the previous IM4000.

In addition, the entire sample stage of the IM4000Plus can be removed for convenience when setting specimen and fine positioning a cross section cutting edge using an external high-resolution optical microscope.

Conventional mechanical polishing or cutting techniques on soft, composite materials apply significant lateral sheer forces to the sample and often result in cross-section surface artifacts such as scratches, smearing, wash-out of softer materials, delamination and other damage. In contrast, ion beam sputtering is a stress-free physical process whereby atoms are ejected from a target material due to bombardment of the target by energized particles. Mirror-surface quality cross sections are created by forming an ion beam resistant mask on a sample surface in such way that one half of the vertically incident ion beam is blocked by the mask. The other half of the ion beam gradually removes the sample material protruding from the mask, and as a result, a straight cross sectional plain is formed below the edge of the protective mask.

The range of materials and samples that can be subjected to ion cross section milling is not limited to hard matter. In fact, high-quality sectioning can be achieved with the IM4000Plus even with "soft" samples such as paper, polymers, and powders.

The wide, polished areas can be achieved as the sample rotation (or swing) center axis is shifted from the ion beam center, thereby compensating the intensity distribution of the ion beam profile. A variable beam incidence angle (freely selectable from vertical to glancing incidence) allows both a perfect smoothing - for example in preparation for EBSD analysis - or a selective enhancement of specimen surface features (relief milling) for optimized SEM observation.

A high-resolution optical microscope is optionally available with the IM4000Plus to enable live observation of the cross section cutting area through a window in the processing chamber. This supports the user in various tasks such as deciding the end point of sample milling when dealing with unknown materials.

The IM4000Plus Series Ion-Milling Systems are the second-generation of IM4000 series hybrid instruments that support Cross-Section Milling and Flatmilling. A wide variety of system configurations are available: Standard, Cooling, Air Protection, and Cooling & Air Protection.

The cryogenic versions of the and IM4000Plus provide active cooling of the cross section milling stage during sample processing. A liquid nitrogen dewar is connected to the cross section stage to effectively remove ion beam milling induced heat from the shielding mask and sample.

The Cryo Temperature Controller (CTC) allows the user to set a desired cooling temperature during the milling process. This is achieved by placing a heater and temperature sensor directly at the cross section shielding mask so that any desired process temperature can be accurately maintained.

Sample cooling can support damage-free cross section milling of highly temperature sensitive specimen such as polymers or soft metals. However, even with active cooling applied, it is important to choose proper processing parameters, especially for samples with low thermal conductivity, because the heat generated at the direct impact point of the ion beam must first be effectively conducted to the cooled parts embedded in the specimen. The IM4000Plus with CTC provides high ion beam currents even at lower "gentle" accelerating voltages, and is therefore optimally suited for this type of work.

For occasional temperature-sensitive applications, an optionally available pre-cooled heat sink block can be easily attached to the cross section milling stage of the standard IM4000Plus unit. By pre-chilling this cooling block in a freezer prior to starting milling, samples can be effectively cooled during the typical short processing times in IM4000Plus.

Advanced materials - especially those related to Lithium battery research - require strict protection from the atmosphere during transfer from cross sectional preparation to analysis through SEM. IM4000Plus air protect is a retrofittable solution for IM4000Plus instruments that allows samples prepared and encapsulated under protective atmospheric conditions to be loaded in a glove box and then into the IM4000Plus and to be exported under vacuum conditions after cross section milling.

A manipulator mechanism attached to the viewing window on top of the specimen chamber allows sealed sample capsules to be opened after IM4000Plus evacuation, and to be re-encapsulated prior to chamber venting. Standard capsules can be directly transferred into the air protect specimen exchange chambers, which are optionally available for all Hitachi FE-SEM Original encapsulation of samples to be ion milled is supported by a fully mechanical fit type holder-and-shielding mask mechanism, which eliminates the fine mechanical setting and adjustment tasks that are usually hard to accomplish wearing thick rubber gloves inside a glove box.

The application picture below shows the importance of such air protected sample preparation work. In this example, a negative electrode of a Li ion battery is first observed under air protected transfer to the SEM, and then observed a second time after 10 minutes of exposure to the room atmosphere.

millstar | carbide die and mold tooling systems

Millstar Profile Milling Tools represent the latest advances in both profile and contour milling technology. As a result of our advanced manufacturing processes, customers see results such as shorter machining and lead times, higher machining accuracy and true contouring results that never fail to please. Millstar die and mold profile tools are designed for conventional profile machining as well as high speed and hard milling with modern machine tools and methods. Our machining accuracy is second to none, and you can count on receiving your machinery quicker than any of our competitors. That is our Millstar promise to our customers, a promise that we never fail to keep.

Customers of ours include die and mold machining companies, aluminum extrusion companies, high speed machining mold makers and companies from the aerospace and medical component industries. Insert tooling is typically used in roughing and finishing applications, a state of the art that your company deserves and should be able to count on. Importantly for you, Millstar always delivers the exact results that you seek, meeting or exceeding your expectations with an accuracy and delivery time that will leave you most satisfied and ready to place your next order.

Take advantage of the remarkable resources at your disposal on this web site. Our web site contains our entire catalog, along with individual spec sheets for our very popular products. Download them at your leisure. Read our technology articles, watch our HD videos, and be sure to visit our frequently asked question (FAQ) page if you have any questions that need answering. Ready to get started to improve your manufacturing processes with the highest quality milling available? Then Contact Us to begin your journey towards dramatically improving your manufacturing results with shorter lead times, higher machining accuracy and the results that you have been searching the market for.

designware usr/xsr die-to-die phy ip

The DesignWare USR/XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency, low-power, and compact PHY supports NRZ and PAM-4 signaling from 2.5G to 112G data rates and is compliant with the OIF CEI-112G and CEI-56G standards for ultra-short reach (USR) and extra- short reach (XSR) links. The USR/XSR PHY offers flexible layout for maximum bandwidth per die-edge by allowing placement of the square macros along all edges of the die. It deploys 16-lane transmit and receive macros for optimized segmentation on the multiple dies. The robust DLL-based clock forwarded architecture enables high energy efficiency while supporting reliable links of up to 50 millimeters for large MCMs. The PHY enables multi-die connectivity over organic substrates, which helps reduce packaging costs without requiring advanced interposer-based packaging over shorter distances. The embedded bit error rate (BER) tester and nondestructive 2D eye monitor capability provide on-chip testability and visibility into channel performance. Besides the PMA and PMD, the PHY includes a raw-PCS to facilitate the interface with the on-chip network, regardless of the existing networking protocol. The USR/XSR IP is combined with Synopsys comprehensive routing feasibility analysis, packages substrate guidelines, signal and power integrity models, and crosstalk analysis for fast and reliable integration into SoCs. Additional resources: Glossary page: What is a Die-to-Die Interface? Blog: How to Achieve High Bandwidth and Low Latency Die-to-Die Connectivity DesignWare USR/XSR PHY IP Highlights Products Downloads and Documentation 16-lane TX and RX square macros for placement in any edge of the die Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity Implements NRZ and PAM-4 signaling Meets the performance, efficiency and reliability requirements of die-to-die interconnects Robust DLL-based, clock forwarded architecture minimizes complexity and power dissipation Linear equalization and T-Coils in RX and TX allow compliance to XSR links up to 50mm for large MCM designs Low jitter phase-locked loops (PLLs) provide robust timing recovery and better jitter performance Compliant with the OIF CEI-112G and CEI-56G standards for USR and XSR links Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientationSTARs Subscribe Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientationSTARs Subscribe Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientation Name: dwc_d2d_sr112_phy_tsmc5ff_x16ns STARs: Open and/or Closed STARs myDesignWare: Subscribe for Notifications Product Type: DesignWare Cores Documentation: Contact Us for More Information Description: Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation Name: dwc_d2d_sr112_phy_tsmc7ff_x16ns STARs: Open and/or Closed STARs myDesignWare: Subscribe for Notifications Product Type: DesignWare Cores Documentation: Show Documents... Hide Documents... DatasheetDesignWare USR/XSR PHY IP ( PDF )

The DesignWare USR/XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modules (MCMs) for hyperscale data center, AI, and networking applications. The low-latency, low-power, and compact PHY supports NRZ and PAM-4 signaling from 2.5G to 112G data rates and is compliant with the OIF CEI-112G and CEI-56G standards for ultra-short reach (USR) and extra- short reach (XSR) links. The USR/XSR PHY offers flexible layout for maximum bandwidth per die-edge by allowing placement of the square macros along all edges of the die. It deploys 16-lane transmit and receive macros for optimized segmentation on the multiple dies. The robust DLL-based clock forwarded architecture enables high energy efficiency while supporting reliable links of up to 50 millimeters for large MCMs. The PHY enables multi-die connectivity over organic substrates, which helps reduce packaging costs without requiring advanced interposer-based packaging over shorter distances. The embedded bit error rate (BER) tester and nondestructive 2D eye monitor capability provide on-chip testability and visibility into channel performance. Besides the PMA and PMD, the PHY includes a raw-PCS to facilitate the interface with the on-chip network, regardless of the existing networking protocol. The USR/XSR IP is combined with Synopsys comprehensive routing feasibility analysis, packages substrate guidelines, signal and power integrity models, and crosstalk analysis for fast and reliable integration into SoCs. Additional resources: Glossary page: What is a Die-to-Die Interface? Blog: How to Achieve High Bandwidth and Low Latency Die-to-Die Connectivity

milling and threading | lmt tools

The machining of modern construction materials through milling and threading is increasing in importance worldwide. This applies to large-scale production as well as smaller lot sizes. We rely on a consistent focus on performance, future-focused development, short innovation cycles, and full dedication to your needs. To do this, we have combined milling and threading in one product line. This was a logical decision, as milled surfaces often receive threads as well.

With our solid carbide end mills from the DHC (Different Helix Cutter) family, we offer multifunctional high-performance milling cutters for a myriad of roughing and finishing applications. The DHC INOX is especially suited for rust-free materials and the DHC HARDLINE for hardened materials. The SuperFinish2 and SuperFinish4 ball nose cutters are our high-performance tools for die and mould making.

Our production program for milling with indexible inserts encompasses the entire spectrum of face milling, soulder milling, copy milling, and high-feed milling. The MultiEdge product family is ideal for roughing with high removal rates. With tangential indexible inserts, the MultiEdge T90 PRO4 and PRO8 guarantee maximum stability. Our newest generation of the high-feed milling cutter, the MultiEdge 2feed mini, enables optimized impelmentation of the highest possible removal rate, even at lower-performance machining centers.

Thread tapping, as opposed to machining, stands out because of its higher process reliability as well as prolonged tool life. Faster circumferential speeds also significantly increase the economic efficiency of this procedure. A prerequisite for using forming taps is a tool break elongation of at least 8% and a maximum tensile strength of up to 1,400 N/mm2. The new modular HPF Max forming tap is an efficient partner for series production in the automotive industry and mechanical engineering. Its long tool life it made possible by a new carbide substrate, a new coating, and an optimized former geometry. The FormMAX solid carbide forming tap is made of a newly developed fine-grain carbide with an optimized former geometry. To further incease thread quality and tool life, the coated tool surface undergoes a special smoothing process.

Efficient internal thread production is the result of intense tool experience and constantly sets new challenges for our engineering experts. A current example is our new Rasant ChipBreaker tap for reliable thread production in blind bores. Our modular XChange tap is ideal for efficient internal thread production. It consists of a thread part made of carbide and a shank made of steel, combining wear resistance and toughness.

1/2" diameter ballnose end (2fcim) | gorilla mill

Recommended for aggressive machining applications in die, mold and tool steels, (H-13, P-20, A7, D2, etc.). Should be run at specific parameters. Produced with the highest Transverse Rupture Strength (TRS) nano-grain carbide substrate available. See "Speeds and Feeds" calculator.

6500 die bonder

Palomar Technologies is a leading supplier of automated microelectronic assembly machines and contract assembly services with specialization in precision die attach, wire bonding and vacuum reflow solutions. We are proudly an independent USA-based company, owned and operated by local management.

Palomar Technologies provides interconnect solutions for a wide variety of industries and applications. With 45+ years supporting the semiconductor and photonics industries, we have expanded across automotive (LiDAR & power modules), medical, microwave, RF/wireless, Datacom, telecom and a few niche markets.

Palomar Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development, package prototyping, die attach, wire bonding, vacuum reflow, outsourced package assembly, test, and measurement.

Contact Palomar Technologies for more information about our Total Process Solution including Palomar die bonders, Palomar wire and wedge bonders, SST vacuum reflow systems, along with Innovation Centers for outsourced manufacturing and assembly.

The Palomar 6500 Die Bonder offers a balanced combination of accuracy, speed, and flexibility in a compact system footprint. The 6500 Die Bonder performs ultra-high accuracy eutectic and adhesive placements with cycle times under seven seconds using its four-axis positioning system driven by linear motors gliding over air bearings on a steel based frame.

Utilizes advanced geometric pattern matching technology to reliably and accurately locate parts that are randomly oriented or have greyscale variations by using a set of boundary curves that are not tied to a traditional pixel-grid. Maximizes throughput, and enables part inspection both before and after bonding.

Highly accurate computer-controlled heating solution for solder based applications. Available in several forms ranging from a large surface area model to accommodate all part sizes to a heating source incorporated into the tool itself for localized heating.

A comprehensive and centralized data management and analysis system that provides machine and process trend monitoring, storage and traceability of data across platforms, and closed loop process control for increased yields and predictive maintenance.

Dispensing solutions range from the highly consistent Musashi Jetter which is not only surface height and temperature independent but also the highest throughput option for small controlled dispensing and the perfect option for 5G applications to the precisely controlled Nordson Micro Dot time-pressure solution which is capable of dispensing all the way down to 0.006 diameter dots.

A wide variety of options for UV sources ranging from custom designed stages with mirrored surfaces and actuating covers for maximum UV exposure to head mounted UV sources with programmable intensities that can provide the perfect cure profile for the best results.

Seamless integration with all types of barcode scanners, from 2D to 3D, which can be mounted on the bond head or integrated within the workspace of our bonders. Characters on chips can even be read with the onboard vision system. All identification information is tracked and collected in a report for easy review.

Automated inline handlers and conveyor systems to seamlessly bring parts in and out of the workspace. Custom designed for all process to fit all components and even apply heat for bot die and wire applications. Built with integration in mind for fully automatic assembly lines that can include all of our bonders.

high helix end mills for aluminum alloys - ball - tapered reach (mold cutters)

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The tip radius on this Harvey Tool offering of Double Angle Shank Cutters improves strength and wear resistance. Use this tool for several machining operations, including back chamfering, chamfering, deburring, and milling a "V-groove."

We offer a comprehensive selection of more than 24,000 miniature and specialty cutting tools that are all fully stocked. The breadth and depth of our products help solve the industrys toughest machining challenges.

Harvey Tool is committed to designing unique geometries that optimize cutting performance for a variety of materials and applications. We introduce hundreds of new tools to the market every 6 months, offering our customers the solutions they need most.

The tip radius on this Harvey Tool offering of Double Angle Shank Cutters improves strength and wear resistance. Use this tool for several machining operations, including back chamfering, chamfering, deburring, and milling a "V-groove."

We offer a comprehensive selection of more than 24,000 miniature and specialty cutting tools that are all fully stocked. The breadth and depth of our products help solve the industrys toughest machining challenges.

Harvey Tool is committed to designing unique geometries that optimize cutting performance for a variety of materials and applications. We introduce hundreds of new tools to the market every 6 months, offering our customers the solutions they need most.

With its very short length of cut and solid tapered neck for maximum rigidity, this Harvey Tool selection of High Helix End Mills for Aluminum Alloys - Ball - Tapered Reach (Mold Cutters) is offered with TiB2 coating to minimize galling and enhance overall cutter performance.

This line of High Helix End Mills for Medium Alloy Steels - Ball - Tapered Reach (Mold Cutters) is ideal for contour machinin. . .