If you need to know about the start of the pure water plant can refer to the relevant information, Guangzhou Pure Branch Environmental Technology Co., Ltd. mainly to the production of bottled and bottled pure water equipment, usually in the factory to buy bottled or bottled purified water equipment , You can enjoy free plant planning, for the first time the factory can guide you how to handle the relevant documents, and free training for you, and how to help you sell a series of problems you may encounter, the factory perennial sale of water All accessories, reverse osmosis membranes, filter elements, quartz sand, activated carbon, etc., for the sale of any accessories (except supplies), have a one-year warranty period, so you do not have to worry about.
First, the water plant to buy equipment need to have a health permit or wading approval, which is the basic requirements of the water factory permit: In accordance with the national QS certification standards will be opened with pure water plant 1. A set of pure water treatment equipment (ie water equipment) 2. Barrel / bottle of a complete set of automatic filling equipment 3. two air purifier 4. Single door single air shower room one 5. A light inspection box 6. A set of laboratory equipment (a total of nine) 1). Sterilization pot (YXQSG4-280) 2). Thermostat incubator (303A-00) 3). Biological Microscope (XSP-02) 4). Scattering turbidity meter (WG2-1) 5). Digital pH meter (PHS-25) 6). Analytical Balance (TC328) 7). Digital Conductivity Meter (DDS-11A) 8). Drying box (202-0A) 9). Measuring instrument 10). Clean bench Second, for QS certification work around the charges are slightly different, the basic costs are: 1. The application fee: 2200 a unit 2. Inspection costs: according to the national standards of the implementation of the standard there are some differences. 3. The cost of consulting services: 8,000 yuan, the consulting firm to receive (according to different business conditions vary) 4. Laboratory equipment, the cost of about 10,000 yuan equipment 5. Other costs 6000-1000 yuan If you also need to know what please contact us: Li Jingli: 139-2423-0008 400-6846-876 The formal pure water plant bid process Formal small water plant investment about 10 million, equipment investment, including reverse osmosis equipment, storage equipment, sterilization equipment also need vat filling equipment. If you want to be a certain size of the pure water plant must start from the following procedures: health permits, production permits, environmental permits, practitioners health check, industrial and commercial registration, tax registration. Pure water production enterprises procedures and reporting materials: First, to the Trade and Industry Bureau for the name of the pre-nuclear Second, the health supervision for food hygiene permits 1. Do pure water plant need to invest how much? Small daily production of 500 barrels, need to invest 10-20 million, medium-sized production of 1000-2000 barrels per day, need to invest 40-60 million; large-scale production of more than 2000 barrels per day, need to invest 100-200 million. 2.Dopure water plant, what equipment? Major equipment: two-stage reverse osmosis equipment; filling equipment; disinfection equipment; purification equipment; laboratory equipment, and so on. 3. Do pure water plant have what procedures? What do QS certification require? The core is the need to provide equipment manufacturers, must have the equipment of the health documents. Pure water production enterprises procedures and reporting materials A copy of the application form; 1. A copy of practitioners health certificate (1 person 1 card, not handled in the inspection section in time for); 2. Notice of approval of enterprise name; 3. A copy of the identity card (corporate legal person, the person in charge). 4. Notice of Health Permit Commitment; 5. Production and operation sites and the surrounding environment floor plan (marked functional distribution, sanitary facilities and production equipment layout layout); 6. Process, recipe (production and processing industry); 7. Health inspection report; 8. There is a corresponding hygiene system on the wall. Third, the Trade and Industry Bureau for business license 1. Individual industrial and commercial households in the business location of the business; 2. Limited liability company in the administrative service center of the Trade and Industry Bureau window Pure water plant declaration materials: 1. Signed by the chairman of the company to set up a registration application; 2. All shareholders designated ***** or a joint proxy to prove a copy; 3. The original one of the articles of association; 4. With the legal qualifications of the capital verification agencies issued a copy of the original certificate; 5. A copy of the legal person's qualification or a copy of a natural person's identity; (copy of the company's business license) 6. The company directors, supervisors, managers of the name, the residence of the documents and the commission, election or employment of a copy of the original (shareholders resolution); 7. The company statutory ***** staff a document; 8. A copy of the company name pre-approval notice; 9. A copy of the company's proof of residence; 10. The law, regulations must be reported to the approval of the approval documents. Fourth, pure water plant engraved official seal 5. Quality Supervision Bureau for the organization code 1. The original business license and a copy of a copy; 2. A copy of the legal person or person in charge of identity card; 3. Code certificate declaration (with official seal) a. Sixth, tax registration 1. The original business license and a copy of a copy; 2. A copy of the legal person or person in charge of identity card; 3. Tax registration application form (with official seal) a copy. 4. The organization code certificate Seven, the Water Authority for water abstraction permit Application materials: 1. "water permit application" a; 2. The construction project feasibility study report or a water resources demonstration report; 3. With a third party interested in a proof of material. 8. Quality Supervision Bureau for food production permit Procedure: County first trial - city inspection and inspection - reported to the national examination and approval Pure water plant declaration materials: 1. Three copies of the application for food production license; 2. Copies of industrial and commercial business license in triplicate; 3. Copies of food hygiene license in triplicate; 4. A copy of the business code certificate in triplicate; 5. The person in charge of business (legal *****) ID copy of a copy of three copies; 6. The production site layout of two copies; 7. The production process of industrial production process two copies; 8. A corporate quality management documents; 9. A corporate standard text; 10.9000 system certification, export food hygiene registration (registration) card copy Third, do pure water plant must obtain the following "permit" 1. "Production license" "QS certification" Quality and Technical Supervision. 2. "Health Permit" Food and Drug Administration. 3. "practitioners health certificate" health bureau Applicants who have completed the above-mentioned application for approval may apply 1. "Business license" Trade and Industry Bureau. 2. "Tax Registration Certificate" Inland Revenue Department. There are three forms of registration 1. Enterprise "production limited liability company". 2. "self-employed" (7 or less). 3. "Informal Employment Organization" (three unemployed). If you are the unemployed laid-off workers in the form of "informal employment labor organization" in the form of the most appropriate, you can enjoy the government to encourage entrepreneurship tax incentives for three years. 3. Mode of operation Water plant 2. Self-operated water supply station (store) "is now manufacturing sales" 4. Equipment: must be obtained by the Ministry of Health approved the "permit" of the "RO" two reverse osmosis pure water water equipment. 1. Water plant equipment can choose a little fresh water production (at least 1 ton / hour or more. About 1200 barrels / day). 2. The water supply station equipment can be smaller (0.25 tons / hour. About 300 barrels / day). 5. Funds: water plant at least 10 - 15 million (not including the plant) Water station 5 - 8 million or so. Fourth, pure water plant cost analysis The initial production by the daily sales of 150 barrels Direct production costs per barrel of water Electricity: 0.37KW / hour 12 hours / day 0.65 yuan / KW = 2. yuan / day Rent: 3,000 yuan / year 1/365 = 8.2 yuan / day Decoration: 2000 yuan / year 1/365 = 5.5 yuan / day Water: 1 RMB ton 6 tons / day = 6 RMB day Bucket lid: 0.20 RMB month 150 / day = 30 RMB day Bucket cover paste: 0.05 RMB/ month 150 / day = 7.5 RMB day Barrel: 0.10 RMB month 150 / day = 15 RMB day Heat shrinkable sealing film: 0.05 RMB month 150 / day = 7.5 RMB day Tax (tax): 1,200 RMB year 1/365 = 3.28 RMB day Total: 85.88 RMB The cost per barrel: 85.88 RMB 150 barrels = 0.57 RMB barrel 5, pure water plant profit analysis Daily gross income: 7 RMB barrel 150 = 1050 RMB / day Daily net income:1050 RBM -85.88 RMB = 964.12 RMB Monthly profit: 964.12 RMB*30 days = 28923.6 RMB Year net income: 28923.6 RMB*12 = 347083.2 RMB
Processors are manufactured primarily from silicon, the second most common element on the planet (only the element oxygen is more common). Silicon is the primary ingredient in beach sand; however, in that form it isn't pure enough to be used in chips.
The manner in which silicon is formed into chips is a lengthy process that starts by growing pure silicon crystals via what is called the Czochralski method (named after the inventor of the process). In this method, electric arc furnaces transform the raw materials (primarily quartz rock that is mined) into metallurgical-grade silicon. Then to further weed out impurities, the silicon is converted to a liquid, distilled, and then redeposited in the form of semiconductor-grade rods, which are 99.999999% pure. These rods are then mechanically broken up into chunks and packed into quartz crucibles, which are loaded into electric crystal pulling ovens. There the silicon chunks are melted at more than 2,500 Fahrenheit. To prevent impurities, the ovens usually are mounted on very thick concrete cubesoften on a suspension to prevent any vibration, which would damage the crystal as it forms.
After the silicon is melted, a small seed crystal is inserted into the molten silicon and slowly rotated (see Figure 3.3). As the seed is pulled out of the molten silicon, some of the silicon sticks to the seed and hardens in the same crystal structure as the seed. By carefully controlling the pulling speed (1040 millimeters per hour) and temperature (approximately 2,500F), the crystal grows with a narrow neck that then widens into the full desired diameter. Depending on the chips being made, each ingot is 200mm (approximately 8") or 300mm (12") in diameter and more than 5 feet long, weighing hundreds of pounds.
The ingot is then ground into a perfect 200mm- (8") or 300mm-diameter (12") cylinder, with a small, flat cut on one side for positioning accuracy and handling. Each ingot is then cut with a high-precision diamond saw into more than a thousand circular wafers, each less than a millimeter thick (see Figure 3.4). Each wafer is then polished to a mirror-smooth surface.
Chips are manufactured from the wafers using a process called photolithography. Through this photographic process, transistors and circuit and signal pathways are created in semiconductors by depositing different layers of various materials on the chip, one after the other. Where two specific circuits intersect, a transistor or switch can be formed.
The photolithographic process starts when an insulating layer of silicon dioxide is grown on the wafer through a vapor deposition process. Then a coating of photoresist material is applied, and an image of that layer of the chip is projected through a mask onto the now light-sensitive surface.
Doping is the term used to describe chemical impurities added to silicon (which is naturally a nonconductor), creating a material with semiconductor properties. The projector uses a specially created mask, which is essentially a negative of that layer of the chip etched in chrome on a quartz plate. Modern processors have 20 or more layers of material deposited and partially etched away (each requiring a mask) and up to six or more layers of metal interconnects.
As the light passes through a mask, the light is focused on the wafer surface, exposing the photoresist with the image of that layer of the chip. Each individual chip image is called a die. A device called a stepper then moves the wafer over a little bit, and the same mask is used to imprint another chip die immediately next to the previous one. After the entire wafer is imprinted with a layer of material and photoresist, a caustic solution washes away the areas where the light struck the photoresist, leaving the mask imprints of the individual chip circuit elements and pathways. Then, another layer of semiconductor material is deposited on the wafer with more photoresist on top, and the next mask is used to expose and then etch the next layer of circuitry. Using this method, the layers and components of each chip are built one on top of the other until the chips are completed.
Some of the masks are used to add the metallization layers, which are the metal interconnects used to tie all the individual transistors and other components together. Most older chips use aluminum interconnects, although during 2002 many moved to copper. The first commercial PC processor chip to use copper was the 0.18-micron Athlon made in AMD's Dresden fab, and Intel shifted the Pentium 4 to copper with the 0.13-micron Northwood version (see Figure 3.5). Copper is a better conductor than aluminum and allows smaller interconnects with less resistance, meaning smaller and faster chips can be made. The reason copper hadn't been used until recently is that there were difficult corrosion problems to overcome during the manufacturing process that were not as much of a problem with aluminum. Now that these problems have been solved, more and more chips are fabricated with copper interconnects.
The Pentium III and Celeron chips with the "coppermine" (codename for the 0.18-micron die used in those chips) die used aluminum and not copper metal interconnects as many people assume. In fact, the chip name had nothing to do with metal; the codename instead came from the Coppermine River in the Northwest Territory of Canada. Intel has long had a fondness for using codenames based on rivers (and sometimes, other geological features), especially those in the northwest region of the North American continent. For example, an older version of the Pentium III (0.25-micron die) was codenamed Katmai, after an Alaskan river. Intel codenames read like the travel itinerary of a whitewater rafting enthusiast: Deerfield, Foster, Northwood, Tualatin, Gallatin, McKinley, and Madison are all rivers in Oregon, California, Alaska, Montana, andin the case of DeerfieldMassachusetts and Vermont.
Another technology that is becoming common is the use of silicon on insulator (SOI) instead of CMOS technology. AMD uses SOI for its 90-namometer (0.09-micron) processors, and it's expected that SOI, which provides better insulation than CMOS for transistors, will continue to grow in popularity.
A completed circular wafer has as many chips imprinted on it as can possibly fit. Because each chip usually is square or rectangular, there are some unused portions at the edges of the wafer, but every attempt is made to use every square millimeter of surface.
The industry is going through several transitions in chip manufacturing. The trend in the industry is to use both larger wafers and a smaller chip die process. Process refers to the size and spacing of the individual circuits and transistors on the chip. In late 2001 and into 2002, chip manufacturing processes began moving from the 0.18-micron to the 0.13-micron process, the metal interconnects on the die began moving from aluminum to copper, and wafers began moving from 200mm (8") to 300mm (12") in diameter. The larger 300mm wafers alone enable more than double the number of chips to be made, compared to the 200mm used previously. The smaller 0.13-micron and 0.09-micron (90-nanometer) processes enables more transistors to be incorporated into the die while maintaining a reasonable die size and allowing for a sufficient yield. This means the trend for incorporating more and more cache within the die will continue, and transistor counts will rise to 1 billion per chip or more by 2010.
As an example of how this can affect a particular chip, let's look at the original Pentium 4. The standard wafer size used in the industry for many years was 200mm in diameter, or just under 8". This results in a wafer of about 31,416 square millimeters in area. The first version of the Pentium 4 with the Willamette core used a 0.18-micron process with aluminum interconnects on a die that was 217 square millimeters in area, had 42 million transistors, and was made on 200mm wafers. Therefore, up to 145 of these chips could fit on a 200mm (8") wafer.
The Pentium 4 processors with the Northwood core that followed it use a smaller 0.13-micron process with copper interconnects on a die that is 131 square millimeters in area with 55 million transistors. Northwood has double the on-die L2 cache (512KB) as compared to Willamette, which is why the transistor count is significantly higher. Even with the higher transistor count, the smaller 0.13-micron process results in a die that is more than 60% smaller, allowing up to 240 chips to fit on the same 200mm (8") wafer that could hold only 145 Willamette die.
Starting in early 2002, Intel began producing Northwood on the larger 300mm wafers, which have a surface area of 70,686 square millimeters. These wafers have 2.25 times the surface area of the smaller 200mm wafers, enabling more than double the number of chips to be produced per wafer. In the case of the Pentium 4 Northwood, up to 540 chip dies fit on a 300mm wafer. By combining the smaller die with the larger wafer, Pentium 4 production has increased by more than 3.7 times since the chip was first introduced. This is one reason newer chips are often more plentiful and less expensive than older ones.
In 2004, the industry began moving to the 90-nanometer (0.09-micron) process, allowing even smaller and faster chips to be made. Most new chips in 2005 were based on the 0.09-micron process, and it's expected that this will continue throughout 2006.
In 2007, we'll likely see a move toward a 65-nanometer process, and we'll see a 45-nanometer process in 2010. These advancements in process will allow 1 billion transistors per chip in 2010! All these will still be made on 300mm wafers because the next wafer transition isn't expected until 2013, when a transition to 450mm wafers is being considered. Table 3.17 lists the CPU process transitions.
Note that not all the chips on each wafer will be good, especially as a new production line starts. As the manufacturing process for a given chip or production line is perfected, more and more of the chips will be good. The ratio of good to bad chips on a wafer is called the yield. Yields well under 50% are common when a new chip starts production; however, by the end of a given chip's life, the yields are normally in the 90% range. Most chip manufacturers guard their yield figures and are very secretive about them because knowledge of yield problems can give their competitors an edge. A low yield causes problems both in the cost per chip and in delivery delays to their customers. If a company has specific knowledge of competitors' improving yields, it can set prices or schedule production to get higher market share at a critical point.
After a wafer is complete, a special fixture tests each of the chips on the wafer and marks the bad ones to be separated out later. The chips are then cut from the wafer using either a high-powered laser or diamond saw.
After being cut from the wafers, the individual dies are then retested, packaged, and retested again. The packaging process is also referred to as bonding because the die is placed into a chip housing in which a special machine bonds fine gold wires between the die and the pins on the chip. The package is the container for the chip die, and it essentially seals it from the environment.
After the chips are bonded and packaged, final testing is done to determine both proper function and rated speed. Different chips in the same batch often run at different speeds. Special test fixtures run each chip at different pressures, temperatures, and speeds, looking for the point at which the chip stops working. At this point, the maximum successful speed is noted and the final chips are sorted into bins with those that tested at a similar speed. For example, the Pentium 4 2.0A, 2.2, 2.26, 2.4, and 2.53GHz are all exactly the same chip made using the same die. They were sorted at the end of the manufacturing cycle by speed.
One interesting thing about this is that as a manufacturer gains more experience and perfects a particular chip assembly line, the yield of the higher-speed versions goes way up. So, of all the chips produced from a single wafer, perhaps more than 75% of them check out at the highest speed and only 25% or less run at the lower speeds. The paradox is that Intel often sells a lot more of the lower-priced, lower-speed chips, so it just dips into the bin of faster ones, labels them as slower chips, and sells them that way. People began discovering that many of the lower-rated chips actually ran at speeds much higher than they were rated, and the business of overclocking was born.
As people learned more about how processors are manufactured and graded, an interesting problem arose: Unscrupulous vendors began re-marking slower chips and reselling them as if they were faster. Often the price between the same chip at different speed grades can be substantialin the hundreds of dollarsso by changing a few numbers on the chip, the potential profits can be huge. Because most of the Intel and AMD processors are produced with a generous safety marginthat is, they typically run well past their rated speedsthe re-marked chips would seem to work fine in most cases. Of course, in many cases they wouldn't work fine, and the system would end up crashing or locking up periodically.
At first, the re-marked chips were just a case of rubbing off the original numbers and restamping with new official-looking numbers. These were easy to detect, though. Re-markers then resorted to manufacturing completely new processor housings, especially for the plastic-encased Slot 1 and Slot A processors from Intel and AMD that were popular in the late '90s and still quite common just a few years ago. Although it might seem to be a huge bother to make a custom plastic case and swap it with the existing case, because the profits can be huge, criminals find it very lucrative. This type of re-marking is a form of organized crime and isn't just some kid in his basement with sandpaper and a rubber stamp.
Intel and AMD have seen fit to put a stop to some of the re-marking by building overclock protection in the form of a multiplier lock into most of their chips dating back nearly 10 years. This is usually done in the bonding or cartridge manufacturing process, where the chips are intentionally altered so they won't run at any speeds higher than they are rated. Usually this involves changing the bus frequency (BF) pins or traces on the chip, which control the internal multipliers the chip uses. At one point, many feared that fixing the clock multiplier would put an end to hobbyist overclocking, but that proved not to be the case. Enterprising individuals found ways to run their motherboards at bus speeds higher than normal, so even though the CPU generally won't allow a higher multiplier, you can still run it at a speed higher than it was designed for by ramping up the speed of the processor bus.
The real problem with the overclock protection as implemented by Intel and AMD is that the professional counterfeiter has often been able to figure out a way around it by modifying the chip physically. Today's socketed processors are much more immune to these re-marking attempts, but it is still possible, particularly because the evidence can be hidden under a heatsink. To protect yourself from purchasing a fraudulent chip, verify the specification numbers and serial numbers with Intel and AMD before you purchase. Also beware where you buy your hardware. Purchasing over online auction sites can be extremely dangerous because defrauding the purchaser is so easy. Also, traveling computer show/flea market arenas can be a hotbed of this type of activity. Finally, I recommend purchasing only "boxed" or retail-packaged versions of the Intel and AMD processors, rather than the raw OEM versions. The boxed versions are shrink-wrapped and contain a high-quality heatsink, documentation, and a 3-year warranty with the manufacturer.
Fraudulent computer components are not limited to processors. I have seen fake memory, fake mice, fake video cards, fake cache memory, counterfeit operating systems and applications, and even fake motherboards. The hardware that is faked usually works but is of inferior quality to the type it is purporting to be. For example, one of the most highly counterfeited pieces of hardware at one time was the Microsoft mouse. They originally sold for $35 wholesale, yet I could purchase cheap mice from overseas manufacturers for as little as $2.32 each. It didn't take somebody long to realize that if they made the $2 mouse look like a $35 Microsoft mouse, they could sell it for $20 and people would think they were getting a genuine article for a bargain, while the thieves ran off with a substantial profit.
Variations on the pin grid array (PGA) chip packaging have been the most commonly used chip packages over the years. They were used starting with the 286 processor in the 1980s and are still used today, although not in all CPU designs. PGA takes its name from the fact that the chip has a grid-like array of pins on the bottom of the package. PGA chips are inserted into sockets, which are often of a zero insertion force (ZIF) design. A ZIF socket has a lever to allow for easy installation and removal of the chip.
Most Pentium processors use a variation on the regular PGA called staggered pin grid array (SPGA), in which the pins are staggered on the underside of the chip rather than in standard rows and columns. This was done to move the pins closer together and decrease the overall size of the chip when a large number of pins is required. Figure 3.6 shows a Pentium Pro that uses the dual-pattern SPGA (on the right) next to an older Pentium 66 that uses the regular PGA. Note that the right half of the Pentium Pro shown here has additional pins staggered among the other rows and columns.
Older PGA variations had the processor die mounted in a cavity underneath the substrate, with the top surface facing up if you turned the chip upside down. The die was then wire-bonded to the chip package with hundreds of tiny gold wires connecting the connections at the edge of the chip with the internal connections in the package. After the wire bonding, the cavity was sealed with a metal cover. This was an expensive and time-consuming method of producing chips, so cheaper and more efficient packaging methods were designed.
Most modern processors are built on a form of flip-chip pin grid array (FC-PGA) packaging. This type still plugs into a PGA socket, but the package itself is dramatically simplified. With FC-PGA, the raw silicon die is mounted face down on the top of the chip substrate, and instead of wire bonding, the connections are made with tiny solder bumps around the perimeter of the die. The edge is then sealed with a fillet of epoxy. With the original versions of FC-PGA, you could see the backside of the raw die sitting on the chip.
Unfortunately, there were some problems with attaching the heatsink to an FC-PGA chip. The heatsink sat on the top of the die, which acted as a pedestal. If you pressed down on one side of the heatsink excessively during the installation process (such as when you were attaching the clip), you risked cracking the silicon die and destroying the chip. This was especially a problem as heatsinks became larger and heavier and the force applied by the clip became greater.
AMD decreased the risk of damage by adding rubber spacers to each corner of the chip substrate for the Athlon XP, thus preventing the heatsink from tilting excessively during installation. Still, these bumpers could compress, and it was all too easy to crack the die.
Intel revised its packaging with a newer FC-PGA2 version used in later Pentium III and all Pentium 4 processors. This incorporates a protective metal cap, dubbed a heat spreader, to protect the CPU from damage when the heatsink is attached. Ironically, the first processor for PCs to use a heat spreader was actually made by AMD for its K6 family of processors.
The Athlon 64 processor family uses a heatsink design different from the Athlon XP. On the Athlon 64 family, the heatsink is attached to a clip. The clip is then screwed to the motherboard, which helps prevent damage to the processor. The Athlon 64, Opteron, and Socket 754 versions of the Sempron also use a heat spreader on top of the processor die, enabling larger and heavier heatsinks to be installed without any potential damage to the processor core.
Future packaging directions are headed toward what is called BBUL (bumpless build-up layer) packaging. This will embed the die completely in the package; in fact, the package layers will be built up around and on top of the die, fully encapsulating it within the package. This will embed the chip die and allow for a full flat surface for attaching the heatsink, as well as shorter internal interconnections within the package.
Intel and AMD used cartridge- or board-based packaging for some of their processors from 1997 through 2000. This packaging was called single edge contact cartridge (SECC) or single edge processor package (SEPP) and consisted of the CPU and optional separate L2 cache chips mounted on a circuit board that looked similar to an oversized memory module and that plugged into a slot. In some cases, the boards were covered with a plastic cartridge cover.
The SEC cartridge is an innovativeif a bit unwieldypackage design that incorporates the back-side bus and L2 cache internally. It was used as a cost-effective method for integrating L2 cache into the processor before it was feasible to include the cache directly inside the processor die.
A less expensive version of the SEC is called the single edge processor (SEP) package. The SEP package is basically the same circuit board containing processor and (optional) cache, but without the fancy plastic cover. This was used mainly by the lower-cost early Celeron processors. The SEP package plugs directly into the same Slot 1 connector used by the standard Pentium II or III. Four holes on the board enable the heatsink to be installed.
Slot 1, as shown in Figure 3.7, is the connection to the motherboard and has 242 pins. AMD used the same physical slot but rotated it 180 and called it Slot A. The SEC cartridge or SEP processor is plugged into the slot and secured with a processor-retention mechanism, which is a bracket that holds it in place. There also might be a retention mechanism or support for the processor heatsink. Figure 3.8 shows the parts of the cover that make up the SEC package. Note the large thermal plate used to aid in dissipating the heat from this processor. The SEP package is shown in Figure 3.9.
With the Pentium III, Intel introduced a variation on the SEC packaging called single edge contact cartridge version 2 (SECC2). This new package covered only one side of the processor board with plastic and enables the heatsink to directly attach to the chip on the other side. This more direct thermal interface allowed for better cooling, and the overall lighter package was cheaper to manufacture. A newer Universal Retention System, consisting of a plastic upright stand, was required to hold the SECC2 package chip in place on the board. The Universal Retention System also worked with the older SEC package as used on most Pentium II processors, as well as the SEP package used on the slot-based Celeron processors. This made it the ideal retention mechanism for all Slot 1based processors. AMD Athlon Slot A processors used the same retention mechanisms as Intel. Figure 3.10 shows the SECC2 package.
The main reason for switching to the SEC and SEP packages in the first place was to be able to move the L2 cache memory off the motherboard and onto the processor in an economical and scalable way. This was necessary because, at the time, it was not feasible to incorporate the cache directly into the CPU core die. After building the L2 directly into the CPU die became possible, the cartridge and slot packaging were unnecessary. Because virtually all modern processors incorporate the L2 cache on-die, the processor packaging has gone back to the PGA socket form.
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Dear sir, we are a leading glass bottle making company India with any our own Quartz sand manufacturing facility. During the manufacturing, we are generating a lot of sand dust & fines (100 to 400 mesh) which we are not able to use. Now, we are planning to use the Sand dust & fines in manufacturing of the glass bottles by using it instead of the manufactured sand in the glass furnace. Since the sand dust & fines cannot be fed into the furnace directly as it is very fine, we need to form small pallets instead of the manufactured sand in the glass furnace. Since the sand dust & fines cannot be fed into the furnace directly as it is very fine, we need to form small pallets in a Palletizer before feeding in the furnace. Since the adhesive property of the sand dust & fines is very poor, we are adding some binders before palletizing/granulating (balls of dim= 2 to 5 mm) the same in a temporary arrangement. I understand that you are manufacturing Pallisters/granulator for the sand dust & fine. We would therefore like to get your technical & commercial offer for a 5 ton /hr. Palletizer/granulator system.
Indian customer wants to produce granules materials with 5 ton per hour. The customer has a glass bottle making company in India. In his factory, there are lots of sand dust and fines wastes, so he wants to turn them into granules with additives like soda ash, sodium nitrite solution, and limestones. With a 5 ton per hour production capacity, the customer wants to make granules with an acre of 1360 square meters(40l*34mh) working space. This Indian customer has his own granulation line. However, in customers fertilizer production line, the rotary drum fertilizer granulator does not work well in his granule line, and its granulation rate is far lower than customers requirements. So, Indian customer want to find a new fertilizer production line solution from us.
Based on Indian customers raw materials and production capacity, the companys engineer team design a 5t/h production line equipped with pan granulator. In the disc pan granulation line, the main machine configurations are as follows:
In the sand dust granulation process, we recommend our disc granulator to our Indian customer. However, this customer fear it cannot make well granulated sand dusts as his required. In views of this, we recommend our customer send his raw materials to our factory for working performance testing.
Since customers trial materials are a bit of more, thus it will be more economic we buy the trial materials for customer and customer just pay for the trail material. This will be more economic and cost efficient on the trial process.
1) Q: In fertilizer machines installation: The complete fertilizer granulation line can be installed in a building with length = 30-meter, width = 22-meter, height = 6 meter? A: as your said, all the belt conveyor has 20-degree slop angle, the whole line length should be 34m, the width and height are ok. 2) Q: In the production line capacities: The plant output is 5 tons of finished granules per hour. A: yes, granules output is 5t/h 3) Q: on the production line wastes emissions: Production yield of the plant = 100 % (means there is no waste generation due to operation) Athe cover will be on pan granulators, on belt conveyor and on screen machine, so no more dust will suspend in the air. and the material in the dust collecting system can be recycled again. 4) Qon the granulation rate of our machine: Minimum % of good quality granule production (without recycle). A: the1-4mm size granules can be 90% 5) Q: on the unqualified materials screening: Maximum % of less than 1mm granules which goes into recycle. A: <1mm granules size no more than 3% 6) Q: on the unqualified materials crushing: Maximum % of more than 5 mm granules which goes into recycle (through chain crusher). A: it is about 7% granules size> 5mm 7) Q: On pan granulation system configuration: Can the granulator be of closed pan type instead of the open pan type as we feel that the closed type design has a better control on the granule quality & also controls the dust generation. A: the granulator part can be covered by iron sheet house (reference following pictures) The dust wont generation. Closed pan type design cannot be realized (because if closed, the material cannot be feeding into two granulators). 8) Q: on the dust collect system: The dust collector system should be adequate to ensure the dust level (SPM = suspended particulate matter) inside the plant should be less than 50 mg/m3. A: the cyclone and dust collecting room and dusting fall room and water curtain dust collector can almost remove the dust fully. and as your requirements, the belt conveyors (colorful steel cover) and disc granulator parts (iron sheet house), and screen machine (reference number 16 answer) will have covers to avoid dust suspend in the air. all these designs can meet your standard suspending dust less than 50mg/m3. 9) Q: on the provision: Provision should be shown for the addition of liquid solidum silicate in the mixer in the final drawing. A: you can check it in the final drawing, we designed for you on the granulation line. 10) Q: on the pan granulation lines electric system: Please provide the motors and variable frequency drives of Siemens. A: Yes, will quote machines price with Symons motor (440V, 50HZ) later, you can find them in the quotation later. 11) Q: On the granulation line machines operation: We would like you to let us know the Operation philosophy of the complete plant. A: I think maybe you want to know how to operate and maintained the whole line. When installation, our engineers will be there to instruct installation, commissioning machines, and training your workers how to operate them, how to easy regular maintenance. And we will send you a PDF machine manual and document one when with machine delivery. 12) Q: On the whole organic fertilizer productions automatic system: What is the level of instrumentation & automation considered. Is a completely automated or semi-automated plant. A: except raw materials loading & finished granules packing & shifting which will be done through mono rail system, only 1 person need to feeding agricultural waste pellet to furnace.) the line is completely automated. 13) Q: on the workers costs of the 5 ton per hour organic fertilizer production line? How many people are required to operate the plant (include all the operations)? Mention the maintenance operations separately. A: 3-4 workers will be needed: 1 for batching machine material feeding; 1 for furnace, 1 or 2 for packing machine. 14) Q: on the screening machines maintenance: On How frequently the rotary screen meshes needs to be changed. Do you recommend that we buy the spare mesh from you or you provide us with the drags for us to procure local? A: half a year need to change the screen mesh for your material. we will provide a set SUS304 stainless steel spare mesh for you, its price is about 600USD. 15) Q: on the Cyclone system: We wanted to know if the Cyclone system will be effective in maintaining the dust levels inside the plant. A: yes, the cyclone collecting dust effect is better than bag system (once your referred). you can see the dust collecting system effect in the video on WhatsApp.
16) Q: on the dust collect system configurations to different machines: You have only indicated dust collector system to be connected to the outlet of the rotary drier ,but we feel that there are other points of dust generation (like Granulator ,Rotary screen, Conveyors) which also needs to be removed through dust collector system. Therefore, we would like you to evaluate the sizing of the dust collection system. We wanted an ambient space where the dust level should not be more than 50 mg/m3. A: For the granulator, conveyor, please reference number 7&8 answer. we can design a cover for screen machine, like this one to avoid dust generation. 17) Q: on the belt conveyors functions and configurations: Please confirm if the all the conveyors will be fully covered & sealed to control the dust from getting into the surrounding atmosphere. A: reference number 8 answer. 18) Q: on the whole granulation plants components configurations: In view of the dust generation in running such plants, we would prefer that you use all the sealed bearings wherever possible, preferable of SKF, FAG, NTN makes. A: No need to use the sealed bearings. because all the machines (machines that dust will generation) will be have a cover to avoid dust generation. using SKF, FAG or NTN sealed bearing will largely increase your budget. Please consider our advice. 19) Q: on the fertilizer machines electric motors supplier: What are the makes of the motors, can it be Siemens IE-3 motors. A: yes, motor can be designed as your requirements. but the machine price will float up relatively. 20) Q: on materials processing and allocating: Can you please explain how the quantities & proportion will be controlled using the system provided. A: the belt conveyor motor of the batching machine is inviter motor, so the belt conveyor moving speed can be regulated on the control box. It means you can control every belt conveyor running speed to control three material quantities & proportion. you can check the dynamic batching machine working video in WhatsApp. 21) Q: on additional tailored configurations to organic materials granulation line: Please include the Liquid sodium silicate storage tank in your scope. A: You can check it in the drawing 22) Q: on the labor costs reduction to the production line: Kindly include all the equipment in your scope which is required to run this plant automatically with minimum manpower (except raw materials loading & finished granules packing & shifting which will be done through mono rail system). Please note that we will go for semi automation only if the automation system becomes more expensive. Kindly indicate the operations which the manpower is required to undertake so that we are very clear about the operating requirements. A: except raw materials loading & finished granules packing & shifting which will be done through mono rail system, only 1 person need to responsible for furnace. other parts of this line are fully automatically. 23) Q: on the batching system operations: As this is a batch granulation therefore how will you control & modulate the continuous flow. Can you explain the operation? A: by batching machine (material feeding parts), you can reference number 20 answers. 24) Q: on the manufacturing materials of pan granulators: What is the material of the surfaces of the granulator & drier which comes in contact with the quartz dust. Is there a possibility of Iron addition in the granules due to the same? A: Both granulator and dryer material are Q235B boiler steel, which has high strength and not easily deformed characteristics. 25) Q: Regarding the combustion system, we do not have a source of natural gas therefore we would request you to give the option for combustion system which uses agricultural waste, sugarcane waste, cow dung waste, pet coke etc. Based on your recommendations we will try to source the fuels locally. The natural gas, furnace oil, diesel will be very costly to operate we prefer agricultural waste pallets with calorific value of 4000 kcal/kg. A: the agricultural waste pellet is good fuel for dryer. can be used on this system. 26) Q: on the combustion system refectory materials. Your offer for the combustion system should include the refractory. However, additionally you can also give the quote for the refractories separately so that we can also try to see if the same can be sourced locally. A: the refractory material of the furnace is fireproof cement and fireproof bricks. you can find it in your country 27) Q: on the fuel consumption of the 5 ton per hour granule making line. We would also like to know the fuel consumption of the recommended system for this 5 ton/hr. line. A: for your 4000Kcal/kg agricultural waste pellet fuel, about 350kg pellet will be need for one hour for this line granules drying. 28) Q: on the dust accumulated system. Please indicate how the dust accumulated from the dust collector system can be reused & necessary conveying system for the same. A: for the cyclone dust recycling, you can use a bag on the cyclone discharge port to collecting dust. and for the dust fall room, your worker just needs to clean it regularly (1 time for a week) 29) Q: on the complete fertilizer production line machines technical specifications: Please send the specifications sheet for the different equipment selected for our line. A: yes, will send you the quotation with detailed specifications. 30) Q: on the packing machine specifications: Please details the scope of the packing machine along with the operations. Is it automated, semi-automatic & whether the manpower is required etc.? A: you can find the packing machine details in the quotation later. packing weight range 500-2000kg. Just need 1-2 workers. 31) Q: on the battery limits of the machine: Kindly define the battery limits of your scope & also mention our scope of work. A: you need to provide: i. cutting machine ii. crane iii. welding machine iv. 7-8 worker for installation. 32) Q: on the quality warranty of the granulation line: Please mention the performance guarantees for this complete granulation line. A: One-year guarantee (Exclusive wearing spare parts). If any parts are found defectively in quality within guarantee, we shall replace them for free. Client should responsible for their own operation mistakes and man-made problems. After guarantee, we can provide all the machine parts with Ext price. 33) Q: on the payment terms of the fertilizer granule line: Also, the payment terms should have 50% advance & 50% after commissioning. A: No, the payment term is 50% T/T deposit, the balance should be paid before delivery. When installation, our engineers will be there to instruct installation, commissioning machines until machines can work normally, and training your workers how to operate this line, how to easy regular maintenance. You just need to pay the round air tickets and 100USD salary /day, and accommodation. 34) Q: on engineer onsite technical supports: Please note that we need your engineers presence for at least 30 days in our plant after the successful commissioning to teach our Operators in operation & fine tuning the quality parameters. A: please reference number 33 answers. 35) Q: on qualifications: Your system should be CE certified. A: Yes, CE certificate can be had, you need to pay extra costs: 910USD. 36) Q: on engineer technical support costs: Your offer should consider a consolidated Installation & Commissioning charges & not on per day basis. A: 100USD salary per day including the instruct installation costs, machines commissioning charges, and worker training costs. 37) Q: on the fuel power and manpower consumption of the total granule fertilizer plants. We would like to know the total power, fuel and manpower requirement to run this line. A: Total powder of this line, you can find it in the quotation. fuel, reference number 25 and 27 replies. 38) Q: on total costs on the granules production: We would also like to know the approx. cost of producing the granules if it cost Rs 500 per man /day, power at Rs 7/kwHr, Agricultural waste fuel at Rs 10/kg, Furnace oil at Rs 45/kg etc. A: approx. cost for one day: 38668.8Rs= 500Rs*4 workers+ 154.8 Kw*Rs7/KwHr* 8Hr+350kg*Rs 10*kg *8Hr
Each box contains detailed installation instructions. We cared that you have fewer errors. Correctly installed parts reduce costs and extend the life of the entire mechanism.If the defect was not caused by installation or incorrect using, Motorherz provides a 12-month warranty for all products.
Recovered spare parts Motorherz-only products suitable for further factory remanufacturing process. Quality units for replacement of exhausted original equipment. A full cycle of diagnostics, remanufacturing, pre-sale preparation and product testing is carried out, which is a guarantee of reliability of the offered parts.
Electric steering racks - production by remanufacturing method, with a check of electronic, computer diagnostics, with adherence to quality of a complete bulkhead and checking the operability and wear resistance of components. Full manual bulkhead and unit check.
Reengineering allows you to abandon production materials containing substances harmful to humans and nature, as well as abandon obsolete technologies and production processes that are not environmentally friendly.
Remanufacturing allows reducing the amount of harmful emissions and production wastes to the environment, by reducing the production cycle during the processing of products, instead of releasing a new one, where appropriate.
All products are anew redesigned by experienced engineers of the company taking into account the revealed features in the operational period. Accurate calculation of the load, including climatic conditions, allows you to create truly reliable components that guarantee a long service life of spare parts, and as a result, a confident and safe operation of the car.
Motorherz GmbH Company is represented by a wide dealer network in Europe and Asia and constantly works on increasing the number of partners, improving the quality of customer service, expanding the products range.
The choice of material and high technical equipment of production lines guarantees the quality of the products. The technology of test and quality requirements, used by German engineers, do not allow trade-offs in safety matters.
Motorherz is the only engineering community that has developed and implemented innovative technologies in the production directions of the steering: linear production of new units and remanufacturing of original, previously operated in work.
In the manufacture of metal components such as thrusts, shafts, distributors, hulls and other power systems of the node, a kind of heat treatment is used, which consists in achieving dissolution of the phase existing at a low temperature in the composition of the metal, this process makes it possible to release a more durable product from the conveyor.
Engineering department Motorherz conducts continuous work on research and development of materials with the purpose of improvement of such parameters as wear resistance, friction, inertia, efficiency, recoverability. Equipment with computer control provides high accuracy in the processing of body parts, as well as uncompromising quality of casting.
A careful choice of material and high technical equipment of production lines guarantees quality. The technology of test and quality requirements, used by German engineers, do not allow trade-offs in safety matters. Putting the Motorherz pump can be sure, replacement will not be required soon. However, in case of repair engineers took care of all the necessary mechanisms. Complex and rare components are available.
As basis of origin brand cardiogram MOTORHERZ laid its external similarity with "timetable" of heart cardiogram. In contrast to the human cardiogram, iron heart MOTORHERZ running absolutely stably and smoothly. That's why brand cardiogram MOTORHERZ has a perfect, symmetrical and smooth a row of "waves", showing stable and efficient operation of all systems.Steering - green color cardiogramStarter Motors and alternators - yellow color of cardiogramTurbochargers - white color cardiogram
Designed to verify workability diodes in the rectifiers of the alternators. With a tester D-320 it is possible to identify not only completely failed (punctured diodes or diodes with a cliff), but also partially faulty diodes, defects which it is impossible to determine with conventional multimeter.
It is designed to check workability of the alternators stator tester included by the star WYE or by triangle DELTA, designed to work with voltages of the vehicle on-board network of 12V, 24V or 32V. Checking one winding when using the Motorherz S-520 tester takes no more than 1-2 minutes.
Level of voltage drop across diodes in rectifiers at a current of 25ALevel of voltage drop across diodes in rectifiers at a current of 5 mAReverse diode current in rectifiers at voltages: 20V / 50V / 100V / 200V (measuring range of reverse current from 0.000mA to 1.999mA)Level of breakdown voltage on avalanche diodes in rectifiersThe voltage of the tester is 220V-240V.The maximum power consumption is 100W.
Designed to test without installing on car, workability of alternators and starter motors of cars and trucks with on-Board network 12 and 24V and measure their electrical parameters. Power supply of stand is made from AC 220V or 380V (depending on version of manufacture). The stand is equipped with an electronic control of an engine, providing smooth starting and stopping of the engine, a smooth adjustment of revolutions of the pulley of the motor from 0 to 3000 rpm in direct and reverse modes. The maximum load current when testing alternators - up to 155A (up to 200A in controllers with variable voltage) provided by the incorporation of 5 independent active load modes (in the version of the stand to the power supply 220V maximum load current when testing alternators - up to 105A (up to 140A in regulators with adjustable voltage), in the stand is provided by validation is not only power, but information outputs of modern alternators: L (D+), P-D, FR-SIG, DFM (LOW and HIGH), RLO, BSS/LIN COM and. Also provided verification of alternators with external voltage regulators A and B types. On devices of the stand during the measurement process occurs visual digital readout of the measured (current and voltage) parameters.
Voltage of tested starters / alternators 12-24 VPower of alternators to be tested .... 0-250 AmpPower of tested starter motors .... 0-5500 WLoad power of alternators under test .... 0-155 AmpStepless speed control ... 0-3000 rpm. (On the alternator pulley 0-6000 rpm)Verification of all types of alternators D +, L-DFM, FR-SIG, P-D, COM, LIN, RLO with any fasteningVerification of all alternators with external relays controlled by field A or BStand power supply .... 380VThe overall dimensions of the stand are 600x800x700mm. Weight 100kg
It is intended for determination of working capacity and measurement of voltage of stabilization of electronic voltage regulators of automobile alternators with voltage of onboard network 12 and 24 volts. The device greatly facilitates the search for a malfunction of the alternator as modern voltage regulators are complex electronic devices and do not lend themselves to direct measurement of parameters.
Level of voltage drop across diodes in rectifiers at a current of 25ALevel of voltage drop across diodes in rectifiers at a current of 5 mAReverse diode current in rectifiers at voltages: 20V / 50V / 100V / 200V (measuring range of reverse current from 0.000mA to 1.999mA)Level of breakdown voltage on avalanche diodes in rectifiersThe voltage of the tester is 220V-240V.The maximum power consumption is 100W.
Voltage of tested starter motors / alternators 2-24 VThe power of alternators to be tested .... 0-250 AmpThe power of tested starter motors .... 0-5500 WLoad power of tested alternators .... 0-105 AmpStepless speed control ... 0-3000 rpm. (On the alternator pulley 0-6000 rpm) Check of all types of alternators D +, L-DFM, FR-SIG, P-D, COM, LIN, RLO with any fasteningChecking all alternators with external relays controlled by field A or BStand power supply .... 220VThe overall dimensions of the stand are 600x800x700mm. Weight 90kg
Checking working capacity of voltage regulators of alternators "A" and "B" typesVerification working capacity of voltage regulators designed for operation at voltages - 12V; 24V; 32VChecking working capacity of a chain winding of excitation "FIELD" voltage regulator at currents - 0,5A; 3.0A; 5.0AChecking operability a chain excitation of the "CHOKE DRIVE" voltage regulatorChecking operability of the diode, a chain winding of excitation of the voltage regulator "FIELD DIODE"Checking operability of a chain lamp signaling of the voltage regulator "LAMP"Checking operability of the "COM" and "LIN" buses of the voltage regulators (short circuit in the bus chain). The definition of the "LIN" or "COM" bus is automaticIndication of a short circuit in the supply circuit of the "SHORT BATTERY" regulatorShort-circuit protection between the terminals "BATTERY POSITIVE" and "BATTERY NEGATIVE"The voltage of the tester is 220V-240VMaximum power consumption - 100W
Tile adhesive manufacturing plant is applied to produce ceramic tile adhesive for house building or wall construction. It processes wastes into quality tile adhesive, and tile adhesive manufacturing plant cost is very low, once you invest one, you will get quick returns! Before you buying a tile adhesive machine, there are some issues you need to know, so that you will get a right plant for your project.
1. Whats you project and how about your project scale. 2. Productivity per day you need. It influences capacity of tile adhesive making machine. 3. Which raw materials you have or you can find? The cheaper the better, it will affect your whole cost. 4. What kind of package method? 5. Whats the destination? 6. Whether needs auxiliary equipment, such as, mixer machine? If you can tell us in detail about above questions, our salesman will give you professional advice for your project, he will help you do a smart and cost-saving investment. And what is worth being mentioned is that if you meet any problems, we will be online. once our tile adhesive manufacturing plant arrived your destination, we will give you free training and technique guidance for your operator till he can operate smoothly. Please remember, no matter you have bought our machine, or havent bought our machine, we will be your side to serve you! GJ10 tile adhesive manufacturing plantSpecifications OfSimple Type Adhesive Title Making Machine Models GJ10 ProductionCapacity(T/H) 10 ControlSystem Semi-auto /Fullauto Please fill in the form below.
From special adhesive mortar production line to mini dry mortar production line, to productivity is 390,000t per year, 600,000t per year, we all have. Our production lines have been exported to Iran, Peru, Vietnam, Thailand, Indonesia, Pakistan, Sri Lanka, Qatar, Cambodia, Korea, etc. You can learn more details from our shipment pictures below. Through our training for local operator, they have began to operate plant smoothly.
Last year, our customer from Iran bought China 30tph fully automatic tile adhesive production line. He said, he did a research, in Iran, there was few mortar production line, he found it was a investment point, therefore, he searched on the google, found our Aimix Group, he was highly attracted by our tile adhesive production line, so he bought it, now he has got great benefits from the tile grout production line. He was very thankfully to us.
Good news! Our mortar making line was on the way to Peru. Up to now, we have sent more than 180 sets of tile adhesive manufacturing plants to abroad, our user in Peru spoke highly of our service. When we receive his inquiry, we made detailed quotation, gave him a lot of advice according to his need and construction condition, he made a decision to buy 10t/h, because his project was not very big, from economic aspect, 10t/h will be his best choice. When you plan to buy a dry mortar production line, please contact us, we will give you the best service and advice, let you get quick returns is our duty!
Tile adhesive machine have different schemes according to different requirement and market. Generally, there are station layout, stepwise layout and tower layout. General process is lift all raw materials have been pretreated to top of raw material silo, depending on the weigh of material itself naturally flow out of the silo, through weighing, batching, mixing, packing, etc processes, tile adhesive is finished. All of production is under the control of modern microcomputer control system. Operator only designate the type and amount, the other operations can be finished by control system automatically, there is no need to monitor. We adopt full-closed production system equipment, site is clean and no powder pollution, ensure the health of operator. Tile adhesive manufacturing plant has modular design, production capacity is connected with development of market, therefore, tile adhesive making machine is with characteristics of high batching accuracy, flexible usage and is convenient to expand.
We mainly have simple type adhesive tile making machine, small type adhesive tile plant, tower type production line, ceramic tile adhesive dry mortar mixing equipment, etc, among them, tower adhesive tile mixer plant is the most popular one.
In addition, it includes sand making system, screening system, material feeding system, conveying system, dust removal system, PLC integrated control system, environmental-protection storage device, lifting conveying system, sand separation system, fine sand recovery device, monitoring system, modular structure, sound insulation and dust-proof device, etc. It is a complete set of dry sand production system. Tile adhesive production line for sale adopts highly intensive tower-type fully closed layout, integrates high-efficiency sand making, optimization and reshaping, gradation adjustment, stone powder control, water content control, environmental protection dust removal in one, not only saves space, improves production efficiency, but also improves quality of various performance indexes such as grain type, gradation and powder content.
Our tile adhesive mixing machine can be equipped with single-stage linear vibrating screen, also classifying screen. As for how to choose right screen system? You can according to the sand, if you use general river sand, and without crusher device, linear vibrating screen is enough; if you use mountain flour, youd better choose rotary screen.
We are professional manufacturer supplyceramic tile production line china, if you choose us, we will provide you with one-stop free service at aspects of design, mortar mix ratio and construction technology to remove your worries. Up to now, there are more than 180 production lines for your visit, we warmly welcome you to visit our ceramic tile ashesive production lines, office and factory. Please fill in the form below.